Economic solution
with high luminous flux
A good balance between performance and cost,
especially suitable for signal lamp applications
Cost effective solution with high-performance capabilities
Optimized package structure offers not only a wide range of design versatility but also economic advantages
Robust architecture with wireless flip-chip technology
Minimize the risk of damage while maintaining high reliability
Ceramic-based package for stable performance
Excellent thermal management solutions ensuring long-term durability
Standard package design with ample design freedom
Common size and pad design for easy usability